ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,571, issued on Feb. 17, was assigned to The Boeing Co. (Arlington, Va.).
"Forming a planar semiconductor surface" was invented by Shanying Cui (Calabasas, Calif.), Samuel J. Whiteley (Venice, Calif.), Jason A. Graetz (Calabasas, Calif.), John J. Vajo (West Hills, Calif.) and Adam E. Sorensen (Moorpark, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a planar semiconductor surface includes forming a workpiece that has a carrier substrate, one or more insulating layers, a semiconductor layer, a first etch stop layer, and a second etch stop layer; forming a contact on the workpiece; biasing the workpiece to a second voltage...