US Patent Issued to The Board of Trustees of the University of Illinois on March 3 for "Atomic layer deposition and vapor deposition reactor with in-chamber microplasma source" (Illinois Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,703, issued on March 3, was assigned to The Board of Trustees of the University of Illinois (Urbana, Ill.).

"Atomic layer deposition and vapor deposition reactor with in-chamber microplasma source" was invented by J. Gary Eden (Champaign, Ill.), Sung-Jin Park (Urbana, Ill.), Andrey Mironov (Urbana, Ill.) and Jinhong Kim (Urbana, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An in-chamber plasma source in a deposition reactor system includes an array of microcavity or microchannel plasma devices having a first electrode and a second electrode isolated from plasma in microcavities or microchannels. An inlet provides connection to deposition prec...