US Patent Issued to TEXAS INSTRUMENTS on Nov. 18 for "Semiconductor package substrate with groove on die pad" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,204, issued on Nov. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor package substrate with groove on die pad" was invented by ChienHao Wang (Taipei, Taiwan), Bob Lee (New Taipei, Taiwan) and YuhHarng Chien (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the m...