US Patent Issued to TEXAS INSTRUMENTS on March 31 for "Package substrate having porous dielectric layer" (Texas Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,710, issued on March 31, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Package substrate having porous dielectric layer" was invented by Jaimal Mallory Williamson (McKinney, Texas) and Jim C. Lo (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a multilayer package substrate includes forming a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer...