ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,843, issued on March 3, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Film covers for sensor packages" was invented by Sreenivasan Kalyani Koduri (Dallas), Leslie Edward Stark (Heath, Texas), Steven Alfred KummerlL (Carrollton, Texas) and Wai Lee (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutt...