ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,542, issued on March 24, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Multi-tool and multi-directional package singulation" was invented by John Carlo C. Molina (Limay, Philippines), Connie A. Esteron (Mabalacat, Philippines) and Ruby Ann M. Camenforte (Pampanga, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a method for manufacturing a semiconductor package comprises coupling first and second semiconductor dies to a metal frame; covering the first and second semiconductor dies and the metal frame with a mold compound; coupling first and second passive components to the first and second semiconductor dies, the fi...