US Patent Issued to TEXAS INSTRUMENTS on July 7 for "Hybrid component with silicon and wide bandgap semiconductor material in silicon recess" (Pennsylvania, Texas Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,458, issued on July 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Hybrid component with silicon and wide bandgap semiconductor material in silicon recess" was invented by Christopher Boguslaw Kocon (Mountain Top, Pa.), Henry Litzmann Edwards (Garland, Texas) and Curry Bachman Taylor (Garland, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device includes a hybrid component. The microelectronic device has a substrate including silicon semiconductor material. The hybrid component includes a silicon portion in the silicon, and a wide bandgap (WBG) structure on the silicon. The WBG structure includes a WBG semiconductor mat...