US Patent Issued to TEXAS INSTRUMENTS on July 28 for "Sensor package with cavity created using sacrificial material" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,791, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Sensor package with cavity created using sacrificial material" was invented by Daiki Komatsu (Beppu, Japan) and Makoto Shibuya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes a semiconductor die having a first surface and a second surface. The first surface is attached to a top surface of a die attach pad, and the second surface has a sensing area thereon. A mold compound covers or encapsulates at least a portion of the die attach pad and the semiconductor die. A channel is formed in a top portion of the mold compound. The channel e...