ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,186, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Cavities in package conductive terminals" was invented by Jefferson Lugue (Baguio City, Philippines) and ZuoHui Chen (Chengdu, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a package comprises a semiconductor die, a gullwing conductive terminal coupled to the semiconductor die, and a mold compound covering the semiconductor die and the conductive terminal. The conductive terminal extends outward from the mold compound. The conductive terminal includes a top surface and a bottom surface opposing the top surface, the conductive terminal includes a first bend ...