ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,833, issued on Jan. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Ball bonding for semiconductor devices" was invented by Ye Zhuang (Chengdu, China), Zi Qi Wang (Deyang, China), Xiao Lin Kang (Chengdu, China), Tingting Yu (Chengdu, China), Jiafeng Liao (Chengdu, China) and Xiaoling Kang (Chengdu, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor die having a die surface, in which the die surface includes a bond pad. A ball bond has a distal surface and flattened-disk shape extending from the distal surface and terminating in a proximal surface spaced apart from the distal surface. The distal...