US Patent Issued to TEXAS INSTRUMENTS on Jan. 20 for "Thermal management in integrated circuit using phononic bandgap structure" (California, Texas Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,772, issued on Jan. 20, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Thermal management in integrated circuit using phononic bandgap structure" was invented by Benjamin Stassen Cook (Los Gatos, Calif.) and Daniel Lee Revier (Addison, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulated integrated circuit includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. Within the encapsulation material, a phononic bandgap structure is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is ope...