US Patent Issued to TEXAS INSTRUMENTS on Feb. 17 for "Molded module package with an EMI shielding barrier" (California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,658, issued on Feb. 17, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Molded module package with an EMI shielding barrier" was invented by Kwang-Soo Kim (Sunnyvale, Calif.), Woochan Kim (San Jose, Calif.) and Vivek Kishorechand Arora (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device that includes a substrate and a die disposed on the substrate, the die having an active surface. Wire bonds are attached from the active surface of the die to the substrate. A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure ...