US Patent Issued to TEXAS INSTRUMENTS on Feb. 10 for "Semiconductor package conductive terminals with reduced plating thickness" (Philippine Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,772, issued on Feb. 10, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor package conductive terminals with reduced plating thickness" was invented by Rafael Jose Lizares Guevara (Angeles, Philippines) and Jose Arvin M. Plomantes (Dagupan, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a method for manufacturing a semiconductor package comprises forming a copper member on a surface; applying a photoresist to the copper member and the surface; and forming a cavity in the photoresist above the copper member. The cavity has a first volume with a first diameter and a second volume with a second diameter larger...