ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,054, issued on Dec. 23, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Electronic device topside cooling" was invented by Laura May Antoinette Dela Paz Clemente (Mabalacat, Philippines) and James Raymond Maliclic Baello (Pampanga, Philippines).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation proce...