US Patent Issued to TEXAS INSTRUMENTS on Dec. 2 for "Industrial chip scale package for microelectronic device" (Texas Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,067, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Industrial chip scale package for microelectronic device" was invented by Sreenivasan K Koduri (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device includes a die with input/output (I/O) terminals, and a dielectric layer on the die. The microelectronic device includes electrically conductive pillars which are electrically coupled to the I/O terminals, and extend through the dielectric layer to an exterior of the microelectronic device. Each pillar includes a column electrically coupled to one of the I/O terminals, and a head contacting the column at an...