US Patent Issued to TEXAS INSTRUMENTS on Dec. 2 for "IC package with multiple dies" (Texas Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,088, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"IC package with multiple dies" was invented by Thomas Dyer Bonifield (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes a first die with a first surface overlaying a substrate. The first die includes a first metal pad at a second surface opposing the first surface. The IC package also includes a dielectric layer having a first surface contacting the second surface of the first die. The IC package further includes a second die with a surface that contacts a second surface of the dielectric layer. The second die includes a second met...