ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,075, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Enhanced mold compound thermal conductivity" was invented by Jaimal Mallory Williamson (McKinney, Texas) and Hiep Xuan Nguyen (Cedar Hill, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupl...