ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,211, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Electronic device with patch antenna in packaging substrate" was invented by Harshpreet Singh Phull Bakshi (Dallas), Rajen Manicon Murugan (Dallas) and Sylvester Ankamah-Kusi (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate has first, second, and third levels including respective dielectric layers and conductive features, the first level including a first trace layer with an antenna and a first via layer with a portion of a ground wal...