US Patent Issued to TEXAS INSTRUMENTS on Aug. 18 for "Semiconductor packages including interface members for welding" (German Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,962, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor packages including interface members for welding" was invented by Tobias Bernhard Fritz (Mainburg, Germany) and Marcus Rudolf Zimnik (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example semiconductor package includes a semiconductor die. In addition, the semiconductor package includes a mold compound having a first side, a second side opposite the first side, and an axis extending between the first side and the second side, the mold compound covering the semiconductor die. Further, the semiconductor package includes an interface member i...