US Patent Issued to TEXAS INSTRUMENTS on Aug. 18 for "Lasing to attach die to lead frame" (Japanese, American Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,963, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Lasing to attach die to lead frame" was invented by Daiki Komatsu (Beppu, Japan) and Kashyap Mohan (Irving, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example method includes placing a semiconductor die on a bonding surface of metal substrate. The die includes metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate. The pillars and the substrate can be formed of a common type of metal. The method also includes controlling a laser to emit laser light to heat the substrate at respective bond...