ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,625, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Through-substrate conductor support" was invented by Virgil Cotoco Ararao (McKinney, Texas) and John Charles Emhke (Garland, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed...