US Patent Issued to TEXAS INSTRUMENTS on April 21 for "Bond wire reliability and process with high thermal performance in small outline package" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,815, issued on April 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Bond wire reliability and process with high thermal performance in small outline package" was invented by Kwang-Soo Kim (Sunnyvale, Calif.) and Vivek Arora (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a package structure, a lead, a heat slug, a semiconductor die, and a bond wire. The package structure has opposite first and second sides, and opposite third and fourth sides spaced along a first direction. The heat slug has a first portion partially exposed outside the second side of the package structure, and a second portion ...