ALEXANDRIA, Va., Aug. 5 -- United States Patent no. RE50,979, issued on Aug. 4, was assigned to Teramount Ltd. (Jerusalem).
"Electro-optical interconnect platform" was invented by Abraham Israel (Jerusalem) and Hesham Taha (Jerusalem).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electro-optical interconnection platform is provided. The platform includes an interface medium; a plurality of optical pads; a plurality of electrical pads; and at least one beam coupler adapted to optically couple at least one pair of optical pads of the plurality of optical pads, wherein the at least one pair of optical pads are placed on opposite sides of the interface medium."
The patent was filed on Feb. 17, 2022, under Ap...