US Patent Issued to Teradyne on Jan. 27 for "Flattening a circuit board assembly using vacuum pressure" (Massachusetts Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,434, issued on Jan. 27, was assigned to Teradyne Inc. (North Reading, Mass.).

"Flattening a circuit board assembly using vacuum pressure" was invented by Eric Boiselle (Lynnfield, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via t...