US Patent Issued to Tencent Technology on April 21 for "Coating method for making chip, chip substrate, and chip" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,799, issued on April 21, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China).

"Coating method for making chip, chip substrate, and chip" was invented by Dengfeng Li (Shenzhen, China), Wenlong Zhang (Shenzhen, China), Kunliang Bu (Shenzhen, China), Maochun Dai (Shenzhen, China) and Yarui Zheng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a coating method for making a chip. The method includes: fixing a substrate on a base. The substrate includes a hole. The method includes controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating mat...