US Patent Issued to Tencent Technology (Shenzhen) on March 3 for "Silicon wafer and method for filling silicon via thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,805, issued on March 3, was assigned to Tencent Technology (Shenzhen) Co. Ltd. (Shenzhen, China).

"Silicon wafer and method for filling silicon via thereof" was invented by Dengfeng Li (Shenzhen, China) and Wenlong Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a silicon wafer and a method for filling a silicon via thereof, and belong to the field of superconducting quantum technologies. The method includes: obtaining a silicon wafer including at least one silicon via; providing a superconducting material on at least one side of the silicon wafer, the at least one side comprising a side where an opening of the si...