US Patent Issued to Tencent Technology, TSINGHUA UNIVERSITY on Nov. 3 for "Conductive paste, preparation method thereof, and preparation method of conductive film" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,931, issued on Nov. 3, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China) and TSINGHUA UNIVERSITY (Beijing).

"Conductive paste, preparation method thereof, and preparation method of conductive film" was invented by Jianshi Tang (Beijing), Zhenxuan Zhao (Beijing), Yuan Dai (Shenzhen, China), Wangwei Lee (Shenzhen, China), Zhengyou Zhang (Shenzhen, China), Jian Yuan (Beijing), Huaqiang Wu (Beijing), He Qian (Beijing) and Bin Gao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a conductive paste, a preparation method thereof. The conductive paste comprises: a thermoplastic polyurethane, conductive particles,...