ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,555, issued on Aug. 11, was assigned to TemperPack Technologies Inc. (Richmond, Va.).
"Void fill packaging product and methods for making" was invented by James McGoff (Richmond, Va.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Briefly described, embodiments of the presently disclosed subject matter relate to void fill packaging products and one or more methods for making the void fill packaging products. The void fill packaging product is configured to cushion items for transport whether that be shipping long distances, local delivery, or self-transport in a vehicle. Specifically, in one aspect, a void fill product for packaging, may include a si...