ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,155, issued on Sept. 29, was assigned to Teknologian tutkimuskeskus VTT Oy (Espoo, Finland).
"Wafer level package for device" was invented by Jae-Wung Lee (Espoo, Finland).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an example aspect of the present invention, there is provided a wafer level package (100) for a device, the package (100) comprising a first substrate (102) and a second substrate (103), at least one insulating stand-off structure (104) between the first substrate (102) and the second substrate (103), a bonding layer (108) on the at least one stand-off structure (104), and a first lateral electrical connection line (109) ...