US Patent Issued to Teknologian tutkimuskeskus VTT on March 24 for "Thermalization arrangement at cryogenic temperatures" (Finnish Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,166, issued on March 24, was assigned to Teknologian tutkimuskeskus VTT Oy (Espoo, Finland).

"Thermalization arrangement at cryogenic temperatures" was invented by Mika Prunnila (VTT, Finland), Alberto Ronzani (VTT, Finland), Emma Mykkanen (VTT, Finland), Antti Kemppinen (VTT, Finland) and Janne Lehtinen (VTT, Finland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermalization arrangement at cryogenic temperatures is dislcosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further compri...