US Patent Issued to TEIKOKU ION, NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY, OKAZAKI MANUFACTURING on Sept. 9 for "Plating apparatus, plating method, and method for producing wire rod having the surface plated" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,536, issued on Sept. 9, was assigned to TEIKOKU ION Co. LTD (Higashiosaka, Japan), NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY (Chiba, Japan) and OKAZAKI MANUFACTURING COMPANY (Kobe, Japan).

"Plating apparatus, plating method, and method for producing wire rod having the surface plated" was invented by Takashi Nakamura (Higashiosaka, Japan), Takuya Kawawaki (Higashiosaka, Japan), Mitsuhiko Terashita (Nishimuro-gun, Japan), Masahiko Hirakami (Higashiosaka, Japan), Masafumi Hojo (Higashiosaka, Japan), Ryosuke Nakamura (Higashiosaka, Japan), Masao Ishikawa (Chiba, Japan), Taketo Nishikawa (Kobe, Japan) and Toshihiko Ryo (Kobe, Japan).

According to the abstract* released ...