US Patent Issued to Tectonic Audio Labs on March 31 for "System, apparatus and methods for coupling a voice coil assembly and diagrapham for acoustic transducer" (American, Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,176, issued on March 31, was assigned to Tectonic Audio Labs Inc. (Woodinville, Wash.).

"System, apparatus and methods for coupling a voice coil assembly and diagrapham for acoustic transducer" was invented by Timothy C. Whitwell (Kirkland, Wash.), Sukvasant Tantikovit (Hong Kong) and Philip C. Bunch (Lake Stevens, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system comprising a diaphragm having a first face and a second face, a roll surround disposed around a perimeter of the first face of the diaphragm, a modal coupling apparatus comprising a plurality of connecting arms and a central body, the modal coupling apparatus coupled to the se...