US Patent Issued to Tech-Etch on Jan. 20 for "Process for developing fine openings in a flexible electronic component with a plasma-etching technique" (Massachusetts Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,722, issued on Jan. 20, was assigned to Tech-Etch Inc. (Plymouth, Mass.).

"Process for developing fine openings in a flexible electronic component with a plasma-etching technique" was invented by Gurinder S. Saini (Arlington, Mass.) and David J. Crary (South Dennis, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of providing access to a contact pad located on a base polyimide layer of an electronic part comprises (i) covering the contact pad and the base polyimide layer with a cover layer comprised of a metallic mask layer, a polyimide layer, and an adhesive layer. The adhesive layer attaches the cover layer to the contact pad and the...