US Patent Issued to TE Connectivity Solutions on July 21 for "Stripline wafer for wafer based connector system" (Pennsylvania Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,161, issued on July 21, was assigned to TE Connectivity Solutions GmbH (Switzerland).

"Stripline wafer for wafer based connector system" was invented by Bruce Allen Champion (Camp Hill, Pa.), Charles Raymond Gingrich III (Mechanicsburg, Pa.), Keith Edwin Miller (Manheim, Pa.), Michael Frank Cina (Elizabethtown, Pa.), Scott Eric Walton (Mount Joy, Pa.) and Joshua Allen Rosenau (York, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer stripline wafer for use in an electrical connector. The multilayer stripline wafer includes multiple layers. Signal transmission pathways are positioned on at least one internal layer of the multiple layers....