US Patent Issued to TDK TAIWAN on May 19 for "Coil module" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,447, issued on May 19, was assigned to TDK TAIWAN CORP. (Taoyuan City, Taiwan).

"Coil module" was invented by Feng-Lung Chien (Taoyuan City, Taiwan), Chien-Hung Lin (Taoyuan City, Taiwan), Kuang-Lun Lee (Taoyuan City, Taiwan) and Wei-Chun Li (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coil module includes a coil assembly, a first induction substrate, a second induction substrate and an adhesive element. The coil assembly has a winding axis. The coil assembly is disposed on the first induction substrate. The first induction substrate is disposed on the second induction substrate. The adhesive element covers the first inducti...