US Patent Issued to TDK on Sept. 22 for "Solder and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,343, issued on Sept. 22, was assigned to TDK Corp. (Tokyo).

"Solder and electronic component" was invented by Toshihiro Iguchi (Tokyo) and Norihisa Ando (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder includes a Sn alloy phase and a particle. The particle has a higher Young's modulus than the Sn alloy phase. The particle has a lower linear expansion coefficient than the Sn alloy phase. An electronic component includes a metal terminal joined thereto with the solder."

The patent was filed on Feb. 1, 2023, under Application No. 18/162,835.

*For further information, including images, charts and tables, please visit: http://patft.uspto...