US Patent Issued to TDK on Sept. 1 for "Circuit substrate and mounted substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,296, issued on Sept. 1, was assigned to TDK Corp. (Tokyo).

"Circuit substrate and mounted substrate" was invented by Akiko Seki (Tokyo), Takashi Watanabe (Tokyo), Yukari Wada (Tokyo), Susumu Taniguchi (Tokyo) and Hiroyuki Uematsu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface."

The patent was filed on Nov. 21, 2022, unde...