US Patent Issued to TDK Electronics on Feb. 10 for "Electrical solder connection, sensor with a solder connection and method of manufacture" (German Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,258, issued on Feb. 10, was assigned to TDK Electronics AG (Munich).

"Electrical solder connection, sensor with a solder connection and method of manufacture" was invented by Bettina Milke (Berlin) and Erkan Eser (Berlin).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad."

The patent was filed on Feb. 26, 2021, under Application No. 17/630,350.

*For further information, including...