US Patent Issued to TATSUTA ELECTRIC WIRE & CABLE on May 19 for "Conductive adhesive layer" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,749, issued on May 19, was assigned to TATSUTA ELECTRIC WIRE & CABLE Co. LTD. (Osaka, Japan).

"Conductive adhesive layer" was invented by Yuusuke Haruna (Kizugawa, Japan) and Hiroshi Tajima (Kizugawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, w...