US Patent Issued to Tangible Robots on Aug. 18 for "Robotic head assembly" (California, Florida Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. D1,142,563, issued on Aug. 18, was assigned to Tangible Robots Inc. (Palo Alto, Calif.).

"Robotic head assembly" was invented by Thomas Vu Nguyen (Longwood, Fla.), Benjamin Soria (Palo Alto, Calif.) and Bipasha Sen (Palo Alto, Calif.).

The patent was filed on July 24, 2025, under Application No. D/014,887.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1142563&OS=D1142563&RS=D1142563

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