US Patent Issued to TANAKA PRECIOUS METAL TECHNOLOGIES on Nov. 3 for "Interposer substrate and method for producing device using the interposer substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,815, issued on Nov. 3, was assigned to TANAKA PRECIOUS METAL TECHNOLOGIES Co. Ltd. (Tokyo).

"Interposer substrate and method for producing device using the interposer substrate" was invented by Koichi Sakairi (Isehara, Japan), Toshinori Ogashiwa (Isehara, Japan) and Mitsutomo Nishizawa (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The interposer substrate is joined in an overlapping state to one or more members having a connection part at one place or more, and electrically connected to the member. The interposer substrate includes a base material having one or more connection regions corresponding to connection parts of the member to...