US Patent Issued to TANAKA ELECTRONICS, MITSUBISHI ELECTRIC on July 28 for "Aluminum bonding wire for power semiconductor" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,576, issued on July 28, was assigned to TANAKA ELECTRONICS Co. Ltd. (Saga, Japan) and MITSUBISHI ELECTRIC Corp. (Tokyo).

"Aluminum bonding wire for power semiconductor" was invented by Shuichi Mitoma (Saga, Japan), Tsukasa Ichikawa (Saga, Japan), Tsuyoshi Uraji (Tokyo), Tatsunori Yanagimoto (Tokyo) and Dai Nakajima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aluminum wire with which, at the time of bonding a bonding wire for a power semiconductor, the wire is not detached from a wedge tool, and a long life is achieved in a power cycle test. The aluminum wire is made of an aluminum alloy having an aluminum purity of 99 mass % or more and...