US Patent Issued to TAIYO YUDEN on June 16 for "Ceramic electronic component, taped package, circuit board, and method for manufacturing ceramic electronic component" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,367, issued on June 16, was assigned to TAIYO YUDEN Co. LTD. (Tokyo).

"Ceramic electronic component, taped package, circuit board, and method for manufacturing ceramic electronic component" was invented by Yusuke Kowase (Tokyo), Yuji Takita (Tokyo) and Maiko Yamane (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ceramic electronic component, in which a dimension in a first direction being equal to or greater than 1.3 times a dimension in a second direction perpendicular to the first direction, includes a multilayer chip having a plurality of internal electrode layers stacked in the first direction; and a pair of external electrodes provided ...