ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,691, issued on Jan. 20, was assigned to TAIYO NIPPON SANSO Corp. (Tokyo).
"Dry ice cleaning apparatus for semiconductor wafers and method for cleaning semiconductor wafers" was invented by Yoshiki Yano (Tokyo) and Keita Fuchigami (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a dry ice cleaning apparatus for a semiconductor wafer and a method for cleaning a semiconductor wafer that can reduce the amount of particles remaining on the surface of a semiconductor wafer, suppress a decrease of cleaning effects due to ice formation, and continuously and effectively clean a large amount of semiconduct...