US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACUTURING on Feb. 17 for "Structure and method for backside-illuminated image device" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,405, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACUTURING COMPANY LTD (Hsinchu, Taiwan).

"Structure and method for backside-illuminated image device" was invented by Hao-Lin Yang (Kaohsiung, Taiwan), Ching-Chun Wang (Tainan, Taiwan), Tzu-Jui Wang (Kaohsiung County, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan) and Dun-Nian Yaung (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor structure that further includes a first substrate having a front side and a back side; a photodetector disposed on the front side of the first substrate and spanning a dimension Dp along a first direction; a gate electrode formed on...