US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Semiconductor strutures with dielectric fins" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,354, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor strutures with dielectric fins" was invented by Ta-Chun Lin (Hsinchu, Taiwan), Kuo-Hua Pan (Hsinchu, Taiwan) and Jhon Jhy Liaw (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and methods of forming the same are provided. A method according to an embodiment includes receiving a workpiece comprising a first semiconductor element and a second semiconductor element, and a dielectric fin disposed between the first semiconductor element and the second semiconductor element. The method also ...