US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 9 for "Semiconductor die package with conductive line crack prevention design" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,827, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor die package with conductive line crack prevention design" was invented by Ya-Huei Lee (Zhunan Township, Miaoli County, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Kuo-Ching Hsu (Taipei, Taiwan), Shyue-Ter Leu (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semi...