US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Semiconductor structure including bottom isolation and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,210, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure including bottom isolation and method for manufacturing the same" was invented by Yu-Ho Chiang (Hsinchu, Taiwan), Wei-Chen Chang (Hsinchu, Taiwan), Jiun-Jie Chao (Hsinchu, Taiwan), Jyh-Huei Chen (Hsinchu, Taiwan) and Jye-Yen Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes: a first fin portion and a second fin portion; a first device and a second device which are respectively disposed on front surfaces of the first and second fin portions, each of the first and sec...