US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Semiconductor structure with daisy chain and a method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,342, issued on Sept. 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure with daisy chain and a method of manufacturing the same" was invented by Tse-Wei Liao (Hsinchu City, Taiwan), Yang-Che Chen (Hsin-Chu City, Taiwan), Chi-Hui Lai (Taichung City, Taiwan), Wei-Yu Chou (Taichung City, Taiwan) and Hsiang-Tai Lu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first die; a molding surrounding the first die; a redistribution layer (RDL) disposed under the first die and the molding, and including a plurality of first conductive pads a...