US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Probe assembly with downward-protruding probe shield and methods of operating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,748,131, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Probe assembly with downward-protruding probe shield and methods of operating the same" was invented by Ming-Cheng Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test apparatus includes a probe assembly, which includes: a multilayer structure including probe contact pads; an upper guide plate including an array of upper holes therethrough; a lower guide plate including an array of lower holes therethrough; a dielectric spacer plate located between the upper guide plate and the lower guide plate and including an opening; an...